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PCB Design Engineer, High Speed Multilayer Systems
Austin, TX
$100,000 to $140,000 per year

This employer is part of a larger global technology organization and is a recognized leader in rugged, open architecture embedded computing for defense, aerospace, and industrial markets. The team designs complex, high-density printed circuit boards supporting next generation embedded computing platforms deployed in demanding environments across military, industrial, and scientific applications. This role sits within that hardware group, working alongside electrical, mechanical, manufacturing, systems, and signal integrity engineers.

Schedule
Full time, direct hire position based in Austin, TX. Travel is minimal.

Compensation
$100,000 to $140,000 per year, based on experience and qualifications.

What You'll Do
As a PCB Design Engineer, you will design complex, high density multilayer PCBs, taking ownership of stack-up construction, via technology (blind, buried, and microvia), routing strategy, and manufacturability across boards typically in the 14 to 24 plus layer range. You will translate electrical schematics into manufacturable layouts for high speed digital interfaces including DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit and high speed Ethernet, Fibre Channel, and SerDes, applying controlled impedance and differential pair routing techniques to meet signal integrity and timing requirements. Work spans both manual and auto-assisted routing depending on design complexity, and you will handle high pin count FPGA layouts, fine pitch BGA and QFN packages, and rigid and rigid-flex designs. You will collaborate closely with electrical, FPGA, mechanical, manufacturing, and signal integrity engineers throughout the design process, participating in design reviews and constraint verification, and will support the full product lifecycle from architecture discussions through fabrication documentation, DFM, DFA, and DFT review, and production release.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Electronic Engineering, or a related discipline, or equivalent industry experience

• Expertise designing complex, high density multilayer PCBs for aerospace, defense, networking, telecommunications, embedded computing, automotive, or other high performance electronic products

• 2+ years of professional PCB layout experience using enterprise class PCB design tools, with Siemens EDA Xpedition strongly preferred

• Experience with Mentor Xpedition Layout, DxDesigner, and associated design libraries and constraint management tools

• Proven experience translating electrical schematics into manufacturable PCB layouts in close collaboration with hardware engineers

• Strong background designing high speed digital PCBs, including DDR4/DDR5, GDDR, PCI Express Gen4/Gen5, Gigabit and high speed Ethernet, Fibre Channel, SerDes, controlled impedance routing, and differential pair routing

• Experience designing dense multilayer boards, typically 14 to 24 or more layers, or equivalent complexity, using both manual and auto-assisted routing techniques

• Strong knowledge of HDI PCB technologies, including blind and buried vias, via-in-pad, sequential lamination, microvias, and advanced stack-up construction

• Hands on experience with BGA, fine pitch BGA, QFN packages, high pin count FPGA layouts, surface mount and through hole technologies, and rigid or rigid-flex PCB designs

• Strong understanding of signal integrity (SI), power integrity (PI), PCB fabrication and assembly processes, and DFM, DFA, and DFT principles

• Experience creating fabrication, assembly, and manufacturing documentation, and validating design quality prior to release

• Must be a U.S. Citizen or Green Card holder (visa sponsorship is not available for this role)

Preferred Qualifications

• Experience migrating or translating PCB designs from platforms such as Altium, Cadence Allegro, OrCAD, PADS, Zuken, or PCAD into Xpedition

• Experience supporting engineering libraries, design rule development, ECO management, and PCB design process improvements

• Experience with RF, analog, mixed signal, and FPGA based PCB layouts

• Familiarity with impedance controlled RF structures, antenna layouts, clock distribution, and high speed memory interfaces

• Experience designing products for aerospace, defense, space, radar, communications, embedded computing, or other mission critical applications

• Working knowledge of IPC standards, military specifications, and high reliability PCB design practices

• Experience mentoring PCB designers or establishing PCB design methodologies and best practices

• Demonstrated ability to leverage AI assisted engineering tools to improve productivity while validating engineering accuracy

Compensation and Benefits

• Salary range of $100,000 to $140,000 per year, plus annual performance incentives

• Medical, dental, and vision insurance

• 401(k) retirement plan with company contribution

• Paid time off and paid holidays

• Career development and technical training opportunities

To apply, submit your resume for consideration.